Ball grid array
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Bottom view of an Intel
Embedded Pentium MMX, showing the blobs of solder
A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used
for integrated
circuits. BGA packages are used to permanently mount devices such as microprocessors. A
BGA can provide more interconnection pins than can be put on a dual
in-line or flat package. The
whole bottom surface of the device can be used, instead of just the perimeter.
The leads are also on average shorter than with a perimeter-only type, leading
to better performance at high speeds.
Soldering of BGA devices requires precise
control and is usually done by automated processes. BGA devices are not
suitable for socket mounting.
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