bga

Ball grid array

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Bottom view of an Intel Embedded Pentium MMX, showing the blobs of solder

A ball grid array (BGA) is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The leads are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Soldering of BGA devices requires precise control and is usually done by automated processes. BGA devices are not suitable for socket mounting.

Contents

  [hide] 

·         1 Description

·         2 Advantages

o    2.1 High density

o    2.2 Heat conduction

o    2.3 Low-inductance leads

·         3 Disadvantages

o    3.1 Noncompliant connections

o    3.2 Difficulty of inspection

o    3.3 Difficulties with BGAs during circuit development

o    3.4 Cost of equipment

·         4 Variants

·         5 Procurement

·         6 See also

·         7 References

·         8 External links

Description[edit]